12-Layer PCB Stackup
Wenshu is a professional 12 layer PCB stackup manufacturer in China, we can provide different solutions for your 12 layer PCB stackup.
Quality Grade | Standard IPC 2 and IPC 3 |
Number of Layers | 2 – 40layers |
Order Quantity | 1pc – 1Million+pcs |
Build Time | 24H – 4weeks |
Material | S1150G, S1165, S1000-2 |
Board Size | Min 5*5mm | Max 500*650mm |
Prototype to Full Turn-Key Assembly
Through-Hole Lead-Free Wave Soldering
Best Price, Genuine Components
Quality Accreditation ISO9001
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Description
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Specification
Introducing our High-Performance 12-Layer PCB Stackup: Redefining Electronics Engineering.
Unlock a new realm of possibilities with our advanced 12-layer PCB Stackup. Tailored to meet the demands of modern electronics, this stackup offers a perfect balance between complexity and efficiency, providing a robust foundation for your intricate circuit designs.
Key Features:
- Optimal Layer Configuration: With 12 precisely engineered layers, this stackup accommodates intricate circuitry while maintaining efficient signal flow and minimized interference.
- High-Speed Design Capability: Seamlessly supports high-speed data transmission, making it ideal for applications in data centers, networking equipment, and advanced electronics.
- Efficient Power Distribution: Distribute power and manage heat dissipation more effectively across multiple layers, ensuring consistent performance and reliability.
- Enhanced Signal Integrity: Leverage dedicated ground and power plane layers to minimize noise, crosstalk, and electromagnetic interference, enhancing signal integrity.
- Flexible Component Integration: Ample space for components, connectors, and routing allows you to design intricate and multifunctional circuits with ease.
- Advanced Routing Flexibility: Accommodate complex routing requirements with specialized signal, ground, and power layers, enabling efficient and compact layouts.
- Effective Thermal Management: Utilize thermal vias and dedicated plane layers to manage heat dissipation, preventing overheating and ensuring optimal operation.
- Precision Impedance Control: Achieve precise impedance matching through dedicated signal layers, catering to high-frequency applications.
- Versatile Applications: Suitable for a wide range of applications, from high-performance computing and telecommunications to advanced consumer electronics and automotive systems.
- Robust Construction: Our 12-layer Stackup is built to withstand challenging environments, ensuring durability and longevity in various operational conditions.
Elevate your projects with the remarkable capabilities of our 12-layer PCB Stackup. Whether you’re working on data-intensive systems, cutting-edge communications, or sophisticated electronic designs, this stackup empowers you to drive innovation to new heights. With meticulous layer design, unmatched signal integrity, and adaptable component integration, it’s the solution you need to bring your visions to life.
Feature | Capability |
---|---|
Quality Grade | Standard IPC 2 and IPC 3 |
Number of Layers | 2 – 40layers |
Order Quantity | 1pc – 1Million+pcs |
Build Time | 24H – 4weeks |
Material | S1150G, S1165, S1000-2 |
Board Size | Min 5*5mm | Max 500*650mm |
Board Thickness | 0.4mm – 6.5mm |
Copper Weight (Finished) | 0.5oz – 10.0oz |
Min Tracing/Spacing | 3mil/3mil |
Solder Mask Sides | As per the file |
Solder Mask Color | Green, White, Blue, Black, Red, Yellow |
Silkscreen Sides | As per the file |
Silkscreen Color | White, Black, Yellow |
Min Annular Ring | 4mil |
Min Drilling Hole Diameter | 6mil |