Communication Motherboard Turnkey PCB Assembly
The high-frequency hybrid splint includes a base plate, which is folded and positioned on the first inner wire layer, the first outer wire layer, and the top surface of the solder mask ink layer from bottom to top in order from top to bottom. The positioning circuit layer, the second outer wire layer, the bottom surface of the substrate The second layer of solder resist ink layer, the substrate includes a high-frequency area and an auxiliary area, the auxiliary area is finally fixed, and the high-frequency area inlay should be located in a fixed position.
| Order Quantity | ≥1PC |
| Quality Grade | IPC-A-610 |
| Size | 50*50mm~510*460mm |
| Min Package | 01005 (0.4mm*0.2mm) |
| Mounting Accuracy | ±0.035mm(±0.025mm) Cpk≥1.0 (3σ) |
| Processing Technology | Electrolytic Foil |
Prototype to Full Turn-Key Assembly
Through-Hole Lead-Free Wave Soldering
Best Price, Genuine Components
Quality Accreditation ISO9001
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Description
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Specification
The Communication Motherboard Turnkey PCB Assembly embodies the perfect harmony of high-frequency hybrid splint technology and seamless communication solutions. Designed to cater to the evolving needs of modern communication, this assembly redefines the standards of efficiency, precision, and reliability. With a meticulous arrangement of layers, circuits, and materials, it optimizes signal transmission and data exchange, providing a robust foundation for your communication endeavors.
Key Features: Communication Motherboard Turnkey PCB Assembly
- High-Frequency Hybrid Design: This assembly features a base plate with multiple layers meticulously positioned to ensure optimal signal flow. It includes high-frequency and auxiliary areas, each contributing to enhanced mechanical support and efficient communication.
- Optimized Material Usage: Leveraging a strategic arrangement of layers, the high-frequency area is constructed using specialized high-frequency materials. This unique design minimizes high-frequency board materials, optimizing cost without compromising signal integrity.
- Hybrid Product Classification: Our assembly operates at the forefront of technology, classifying it as a high-frequency hybrid product. Its design and components ensure exceptional performance in both high-frequency and mixed-pressure scenarios.
- Six-Layer Configuration: This assembly delivers enhanced conductivity and durability by boasting six precisely configured layers, including specialized materials like ro4350b and FR4. Its 1.6mm thickness and 210 mm*280 mm size provide ample space for efficient communication solutions.
- Gold-Plated Surface Treatment: To ensure superior conductivity and longevity, the surface treatment is gold-plated, facilitating seamless data exchange and reliable communication.
- Precision in Detail: With a minimum aperture of 0.25mm, this assembly attains precision down to the tiniest details. This meticulous attention to design ensures that even the most intricate communication signals are transmitted accurately.
Comprehensive Turnkey Solutions:
At Wenshu, we provide more than just a product; we offer comprehensive turnkey PCB assembly services. As your trusted partner, we streamline the process from design to production, ensuring that your communication systems receive the finest attention to detail and performance-driven solutions.
| ltem | Capability |
|---|---|
| Order Quantity | ≥1PC |
| Quality Grade | IPC-A-610 |
| Lead Time | 24 hours expedited service can be offered. 3- 4 days normally for PCBA prototype orders. We will give you an accurate lead time when we quote for you. |
| Size | 50*50mm~510*460mm |
| Board Type | Rigid PCB, Flexible PCB, metal core PCB |
| Min Package | 01005 (0.4mm*0.2mm) |
| Max Package | No limit |
| Mounting Accuracy | ±0.035mm(±0.025mm) Cpk≥1.0 (3σ) |
| Surface Finish | Lead/Lead-free HASL, Immersion gold, OPS, etc. |
| Assembly Types | Surface mount (SMT), Through-hole (DIP), Mixed Technology (SMT & Thru-hole) |
| Component Sourcing | Turnkey (All components sourced by Wenshu), Partial turnkey, Kitted/Consigned |
| BGA Package | BGA Dia. 0.14mm, BGA 0.2mm pitch |
| SMT Parts Presentation | Cut Tape, Partial reel, Reel, Tube, Tray, Laser-cut Stainless Steel |
| Cable Assembly | We supply custom cables, cable assemblies, wiring looms/harnesses and power leads for various industries including automotive, security, mining, medical and entertainment. |
| Stencil | Stencil with or without frame (offered free by Wenshu) |
| Quality Inspection | Visual inspection; AOI checking; BGA placement – X-RAY checking |
| SMT Capacity | 3 Million~4 Million Soldering Pad/day |
| DIP Capacity | 100 Thousand Pins/day |
