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Capability
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High Frequency PCB Capabilities
ltem | Capability |
---|---|
Material | FR-4 Standard Tg 140°C, FR4-High Tg 170°C |
Min. Track/Spacing | For External layers: 4oz Cu 10mil/13mil, 5oz Cu 12mil/15mil, 6oz Cu 15mil/15mil For Internal layers: 4oz Cu 8mil/8mil, 5oz Cu 10mil/10mil, 6oz Cu 12mil/12mil |
Min. Hole Size | 0.15 ~ 0.3mm |
Max Outer Layer Copper Weight (Finished) | 12oz |
Max Inner Layer Copper Weight | 12oz |
Board Thickness | 0.6-6mm |
Surface Finishing | HASL lead-free, Immersion gold, OSP, Hard Gold, Immersion Silver, Enepig |
Solder Mask | Green, Red, Yellow, Blue, White, Black, Purple, Matte Black, Matte green |
Silkscreen | White, Black |
Via Process | Tenting Vias, Plugged Vias, Vias not covered |
Testing | Fly Probe Testing (Free) and A.O.I. testing |
Build time | 5-15 days |
Lead time | 2-3 days |