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Capability
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14 Layer PCB Stackup Capability
ltem | Capability |
---|---|
Quality Grade | Standard IPC 2 and IPC 3 |
Number of Layers | 2 – 40layers |
Order Quantity | 1pc – 1Million+pcs |
Build Time | 24H – 4weeks |
Material | S1150G, S1165, S1000-2 |
Board Size | Min 5*5mm | Max 500*650mm |
Board Thickness | 0.4mm – 6.5mm |
Copper Weight (Finished) | 0.5oz – 10.0oz |
Min Tracing/Spacing | 3mil/3mil |
Solder Mask Sides | As per the file |
Solder Mask Color | Green, White, Blue, Black, Red, Yellow |
Silkscreen Sides | As per the file |
Solder Mask Color | White, Black, Yellow |
Min Annular Ring | 4mil |
Min Drilling Hole Diameter | 6mil |
14-Layer PCB Stackup: Unleash Complexity with Precision
Elevate your electronic designs with the sophistication of our 14-layer PCB stackup, a pinnacle of innovation in modern circuitry. Crafted with meticulous precision, this multilayer configuration is designed to meet the demands of intricate and high-performance applications.
Key Features:
- Layer Dynamics: With fourteen intricately arranged layers, our stackup offers an unparalleled canvas for complex circuitry, enabling seamless integration of components and efficient signal routing.
- Signal Integrity Champion: Engineered to perfection, our stackup design mitigates signal interference, ensuring optimal signal integrity even in the most demanding high-speed scenarios.
- Robust Power Distribution: Dedicated power and ground planes establish a robust power distribution network, curbing voltage fluctuations and guaranteeing consistent performance.
- Component Prowess: The 14-layer stackup accommodates an array of densely packed components, enabling designs that harness efficiency without compromising on functionality.
- EMI Shielding Excellence: Multiple layers contribute to effective electromagnetic interference (EMI) shielding, fostering electromagnetic compatibility (EMC) in sensitive applications.
- Versatile Applications: From advanced communication systems to aerospace electronics, the 14-layer PCB stackup is tailor-made for applications requiring intricate and versatile circuitry.
- Unyielding Reliability: Manufactured under stringent quality control measures, our 14-layer stackup ensures reliability, meeting the standards expected in mission-critical operations.