10-Layer PCB Stackup
Wenshu is a qualified 10 layer PCB stackup manufacturer in China, we can provide a different solution for your 10 layer PCB stackup.
Quality Grade | Standard IPC 2 and IPC 3 |
Number of Layers | 2 – 40layers |
Order Quantity | 1pc – 1Million+pcs |
Build Time | 24H – 4weeks |
Material | S1150G, S1165, S1000-2 |
Board Size | Min 5*5mm | Max 500*650mm |
Prototype to Full Turn-Key Assembly
Through-Hole Lead-Free Wave Soldering
Best Price, Genuine Components
Quality Accreditation ISO9001
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Description
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Specification
Introducing Our Advanced 10-Layer PCB Stackup: Elevate Your Designs to Perfection
Discover the power of precision with our state-of-the-art 10-Layer PCB Stackup. Designed to meet the demands of modern electronics, this stackup offers an optimal balance between complexity and efficiency, providing a solid foundation for your intricate circuit designs.
Key Features:
- Strategically Engineered Layers: With 10 meticulously crafted layers, our stackup accommodates intricate circuitry while maintaining streamlined signal flow and minimal interference.
- High-Speed Ready: Seamlessly support high-speed data transmission, making it perfect for applications in data-intensive sectors, networking, and advanced electronics.
- Efficient Power Management: Distribute power and manage heat effectively across multiple layers, ensuring consistent performance and reliability under varying conditions.
- Enhanced Signal Integrity: Harness the strength of dedicated ground and power plane layers to minimize noise, crosstalk, and electromagnetic interference, elevating signal integrity.
- Flexible Component Integration: Ample space for components, connectors, and routing enables you to craft complex and multifunctional circuits with ease.
- Routing Expertise: Address intricate routing requirements with specialized signal, ground, and power layers, facilitating compact and efficient layout designs.
- Smart Thermal Control: Leverage thermal vias and dedicated plane layers for efficient heat dissipation, safeguarding against overheating and ensuring optimal performance.
- Precise Impedance Management: Achieve exact impedance matching through dedicated signal layers, catering to high-frequency applications with finesse.
- Application Versatility: Ideal for diverse applications, from robust computing and communications systems to advanced consumer electronics and industrial machinery.
- Built to Endure: Our 10-Layer PCB Stackup is crafted to withstand demanding conditions, ensuring durability and longevity across various operational environments.
Elevate your projects with the impressive capabilities of our 10-Layer PCB Stackup. Whether you’re involved in data-driven systems, advanced communications, or intricate electronic designs, this stackup empowers you to drive innovation and bring your visions to life. With carefully honed layer design, unparalleled signal integrity, and adaptable component integration, it’s the solution you need to take your designs to the next level. Choose excellence, adaptability, and performance – choose our Advanced 10-Layer PCB Stackup for a future brimming with possibilities.
Feature | Capability |
---|---|
Quality Grade | Standard IPC 2 and IPC 3 |
Number of Layers | 2 – 40layers |
Order Quantity | 1pc – 1Million+pcs |
Build Time | 24H – 4weeks |
Material | S1150G, S1165, S1000-2 |
Board Size | Min 5*5mm | Max 500*650mm |
Board Thickness | 0.4mm – 6.5mm |
Copper Weight (Finished) | 0.5oz – 10.0oz |
Min Tracing/Spacing | 3mil/3mil |
Solder Mask Sides | As per the file |
Solder Mask Color | Green, White, Blue, Black, Red, Yellow |
Silkscreen Sides | As per the file |
Silkscreen Color | White, Black, Yellow |
Min Annular Ring | 4mil |
Min Drilling Hole Diameter | 6mil |