Air Conditioner Controller DIP Processing
Dip package (Dual In-line Package) can also be called dual in-line packaging technology. This refers to the integrated circuit chips that are packaged in dual in-line form during the dip operation of the PCB board manufacturer PCBA. At present, most. The small and medium-sized integrated circuits will use this packaging method, and the number of pins generally does not exceed 100; the CPU chip in the DIP package has two rows of pins, which need to be inserted into the chip socket with the dip structure, or directly Soldering is performed on PCB boards with the same number of solder holes and geometric arrangement.
| Order Quantity | ≥1PC |
| Quality Grade | IPC-A-610 |
| Size | 50*50mm~510*460mm |
| Min Package | 01005 (0.4mm*0.2mm) |
| Mounting Accuracy | ±0.035mm(±0.025mm) Cpk≥1.0 (3σ) |
| Processing Technology | Electrolytic Foil |
Prototype to Full Turn-Key Assembly
Through-Hole Lead-Free Wave Soldering
Best Price, Genuine Components
Quality Accreditation ISO9001
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Description
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Specification
The Air Conditioner Controller DIP Processing leverages the Dual In-line Package (DIP) innovation to elevate air conditioning control to new heights. This technology encapsulates integrated circuit chips within a compact package, ensuring seamless communication between components and precise temperature management. With a focus on efficiency, reliability, and user-friendly operation, this processing method transforms air conditioning systems into smart, responsive units.
Key Features:
- Dual In-line Package (DIP): The heart of this processing method lies in the DIP package. Integrated circuit chips are encapsulated within the DIP, creating a cohesive unit that facilitates efficient communication and control.
- Enhanced Precision: With DIP processing, air conditioning control achieves a new level of precision. This technology ensures that temperature adjustments are accurate and consistent, providing unparalleled comfort and energy efficiency.
- Seamless Communication: The DIP package optimizes communication between integrated circuit chips, enabling seamless coordination of various components within the air conditioning system. This results in smooth operation and enhanced performance.
- Damage Prevention: The DIP package safeguards the integrated circuit chips, preventing damage during handling and installation. This protective measure guarantees that the air conditioning controller retains its functionality and reliability over time.
- Customization Possibilities: Each air conditioning system is unique, and the DIP processing allows customization to suit specific requirements. This technology adapts to various needs for residential, commercial, or industrial applications.
- Efficient Temperature Management: The precision of DIP processing ensures that air conditioning systems maintain the desired temperature with minimal energy consumption. This leads to cost savings and a reduced environmental footprint.
Process Overview:
The Air Conditioner Controller DIP Processing follows a meticulous process to ensure optimal performance:
- Pre-processing PCB Components: Materials are carefully selected and processed to meet specific model requirements before production. Components are prepared using advanced machinery for consistency and precision.
- Adhesive Application: High-temperature adhesive paper is meticulously applied to the PCB board, blocking tin-plated through holes and components requiring subsequent soldering.
- DIP Plug-in Processing: Highly trained personnel wearing electrostatic wristbands carefully plug-in components according to the component BOM list and the component bit number map. Attention to detail ensures accurate and error-free plug-in.
- Inspection and Quality Check: Every inserted component undergoes a thorough inspection to verify correct placement and prevent errors.
- Wave Soldering: The PCB board is processed through a machine, ensuring robust soldering and secure component attachment.
- High-Temperature Adhesive Tape Removal: The high-temperature adhesive tape is removed after soldering. Visual inspection verifies the quality of soldering.
- Functional Testing: The PCB board undergoes functional testing to ensure that each aspect of the air conditioning control functions properly. Any defects are marked for immediate attention and rectification.
| ltem | Capability |
|---|---|
| Order Quantity | ≥1PC |
| Quality Grade | IPC-A-610 |
| Lead Time | 24 hours expedited service can be offered. 3- 4 days normally for PCBA prototype orders. We will give you an accurate lead time when we quote for you. |
| Size | 50*50mm~510*460mm |
| Board Type | Rigid PCB, Flexible PCB, metal core PCB |
| Min Package | 01005 (0.4mm*0.2mm) |
| Max Package | No limit |
| Mounting Accuracy | ±0.035mm(±0.025mm) Cpk≥1.0 (3σ) |
| Surface Finish | Lead/Lead-free HASL, Immersion gold, OPS, etc. |
| Assembly Types | Surface mount (SMT), Through-hole (DIP), Mixed Technology (SMT & Thru-hole) |
| Component Sourcing | Turnkey (All components sourced by Wenshu), Partial turnkey, Kitted/Consigned |
| BGA Package | BGA Dia. 0.14mm, BGA 0.2mm pitch |
| SMT Parts Presentation | Cut Tape, Partial reel, Reel, Tube, Tray, Laser-cut Stainless Steel |
| Cable Assembly | We supply custom cables, cable assemblies, wiring looms/harnesses and power leads for various industries including automotive, security, mining, medical and entertainment. |
| Stencil | Stencil with or without frame (offered free by Wenshu) |
| Quality Inspection | Visual inspection; AOI checking; BGA placement – X-RAY checking |
| SMT Capacity | 3 Million~4 Million Soldering Pad/day |
| DIP Capacity | 100 Thousand Pins/day |
