Module Patch Plug-in Processing
In PCBA processing, with the chip processing equipment more and more powerful, PCB and electronic components are becoming smaller and smaller, SMT chip processing is becoming more and more popular, chip processing gradually replace the previous plug-in processing. But some circuit boards still need plug-in processing, plug-in processing in the current electronic processing industry is still very common, DIP plug-in processing in the SMD processing is completed.
| Order Quantity | ≥1PC |
| Quality Grade | IPC-A-610 |
| Size | 50*50mm~510*460mm |
| Min Package | 01005 (0.4mm*0.2mm) |
| Mounting Accuracy | ±0.035mm(±0.025mm) Cpk≥1.0 (3σ) |
| Processing Technology | Electrolytic Foil |
Prototype to Full Turn-Key Assembly
Through-Hole Lead-Free Wave Soldering
Best Price, Genuine Components
Quality Accreditation ISO9001
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Description
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Specification
Our Module Patch Plug-in Processing is a cutting-edge solution that marries the best of both worlds—traditional plug-in technology and contemporary module integration. This process revolutionizes the assembly of electronic components, enabling them to work in harmony within a unified system. Designed to meet the demands of diverse industries, this solution delivers unparalleled efficiency and reliability.
Key Features:
- Hybrid Technology: Combining the reliability of plug-in technology with the versatility of module integration, this process optimizes the assembly of electronic components. It caters to various applications, from consumer electronics to industrial automation.
- Efficient Integration: Module Patch Plug-in Processing ensures modules are seamlessly integrated onto the PCB. The process involves meticulous placement and soldering of modules, ensuring robust connections that withstand the test of time.
- Customization Capabilities: Our solution accommodates customization to suit specific requirements. Modules can be chosen based on functionality, size, and compatibility, providing tailored solutions for diverse applications.
- Enhanced Reliability: By integrating electronic modules through precise plug-in and soldering, our process ensures the highest level of reliability. Components work cohesively to deliver consistent performance under various conditions.
- Optimal Performance: Electronic modules are designed to interact seamlessly within the system, resulting in optimal performance. This harmonious integration reduces the risk of malfunctions and enhances the overall efficiency of the assembled electronics.
- Quality Assurance: Rigorous quality checks are performed at every Module Patch Plug-in Processing stage. This stringent quality assurance process guarantees that each integrated module meets industry standards.
Process Highlights:
- Module Selection and Customization: Based on application requirements, modules are carefully selected and customized to fit the intended functionality and design.
- Module Placement: Modules are meticulously placed on the PCB according to predetermined positions for optimal interaction with other components.
- Soldering: Advanced soldering techniques are employed to secure the modules, forming strong and durable connections.
- Quality Inspection: Post-soldering, rigorous quality checks are conducted to ensure correct placement and solder joint integrity.
- Functional Testing: Integrated modules undergo comprehensive functional testing to verify their performance, ensuring they function seamlessly within the system.
| ltem | Capability |
|---|---|
| Order Quantity | ≥1PC |
| Quality Grade | IPC-A-610 |
| Lead Time | 24 hours expedited service can be offered. 3- 4 days normally for PCBA prototype orders. We will give you an accurate lead time when we quote for you. |
| Size | 50*50mm~510*460mm |
| Board Type | Rigid PCB, Flexible PCB, metal core PCB |
| Min Package | 01005 (0.4mm*0.2mm) |
| Max Package | No limit |
| Mounting Accuracy | ±0.035mm(±0.025mm) Cpk≥1.0 (3σ) |
| Surface Finish | Lead/Lead-free HASL, Immersion gold, OPS, etc. |
| Assembly Types | Surface mount (SMT), Through-hole (DIP), Mixed Technology (SMT & Thru-hole) |
| Component Sourcing | Turnkey (All components sourced by Wenshu), Partial turnkey, Kitted/Consigned |
| BGA Package | BGA Dia. 0.14mm, BGA 0.2mm pitch |
| SMT Parts Presentation | Cut Tape, Partial reel, Reel, Tube, Tray, Laser-cut Stainless Steel |
| Cable Assembly | We supply custom cables, cable assemblies, wiring looms/harnesses and power leads for various industries including automotive, security, mining, medical and entertainment. |
| Stencil | Stencil with or without frame (offered free by Wenshu) |
| Quality Inspection | Visual inspection; AOI checking; BGA placement – X-RAY checking |
| SMT Capacity | 3 Million~4 Million Soldering Pad/day |
| DIP Capacity | 100 Thousand Pins/day |
