TG150 PCB Circuit Board
The TG150 PCB Circuit Board is crafted using a specialized blend of materials. It includes a high-temperature laminate and flame-retardant properties. This combination ensures excellent thermal stability, flame resistance, and mechanical strength. This also makes it ideal for demanding environments and applications where reliability is crucial.
| Layers | four layers |
| Material | TG150 |
| Drilling diameter | 0.2mm |
| Minimum line width | 0.08mm |
| Minimum line spacing | 0.1mm |
| Process | Immersion Gold |
Prototype to Full Turn-Key Assembly
Through-Hole Lead-Free Wave Soldering
Best Price, Genuine Components
Quality Accreditation ISO9001
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Description
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Specification
The TG150 PCB Circuit Board stands as a pinnacle of excellence in the world of electronics. Crafted with precision and designed for top-tier performance, this circuit board opens doors to a new realm of possibilities for your electronic projects.
Uncompromising Quality:
Engineered with meticulous attention to detail, the TG150 PCB Circuit Board boasts exceptional quality that you can trust. It is built to withstand demanding environments and rigorous applications, ensuring reliability even in the most challenging conditions. Whether it’s for industrial equipment, aerospace technology, or high-performance electronics, this circuit board’s robust construction guarantees peace of mind.
Advanced Material Composition:
At the heart of the TG150 PCB Circuit Board lies an advanced material composition that sets it apart. With superior thermal and electrical properties, this circuit board ensures optimal conductivity and dissipation of heat. This translates to improved overall performance and longevity of your electronic devices, making it an ideal choice for projects that require efficiency and durability.
Precision Manufacturing:
Crafted using cutting-edge manufacturing processes, the TG150 PCB Circuit Board adheres to the strictest industry standards. Its meticulously designed layers, precise copper traces, and expertly placed components contribute to seamless functionality. The board’s consistency and accuracy ensure smooth signal transmission, reduced interference, and heightened electronic performance.
Versatility Redefined:
The TG150 PCB Circuit Board is a versatile canvas for innovation. Its adaptability to diverse applications makes it suitable for a wide range of industries, from telecommunications and medical devices to automotive electronics and beyond. This versatility empowers you to explore new horizons and create electronics that push boundaries.
Seamless Integration:
Designed to seamlessly integrate into your electronic projects, the TG150 PCB Circuit Board simplifies the assembly process. Its compatibility with advanced assembly techniques, such as surface mount technology (SMT), ensures effortless integration of components, saving time and resources during production.
Choose the TG150 PCB Circuit Board today and embark on a journey of electronic excellence. Unleash your creativity, amplify your designs, and set new standards in electronic performance.
| ltem | Capability |
|---|---|
| Layer Count | 1-40layers |
| Base Material | KB、Shengyi、ShengyiSF305、FR408、FR408HR、IS410、FR406、GETEK、370HR、IT180A、Rogers4350、Rogers4000、PTFE Laminates(Rogers series、Taconic series、Arlon series、Nelco series)、Rogers/Taconic/Arlon/Nelco laminate with FR-4 material (including partial Ro4350B hybrid laminating with FR-4) |
| Board Type | Backplane、HDI、High multi-layer blind&buried PCB、Embedded Capacitance、Embedded resistance board 、Heavy copper power PCB、Backdrill, PCB Gold Finger |
| Board Thickness | 0.2-5.0mm |
| Copper Thickness | Min. 1/2 OZ, Max. 10 OZ |
| PTH Wall | 25um(1mil) |
| Maximum Board Size | 1100*500mm(43”*19”) |
| Min laser drilling size | 4mil |
| Min.spacing/Tracing | 2.7mil/2.7mil |
| Solder Mask | Green, Black, Blue, Red, White, Yellow, Purple matte/glossy |
| Surface Treatment | Flash gold(electroplated gold)、ENIG、Hard gold、Flash gold、HASL Lead-free 、OSP、ENEPIG、Soft gold、Immersion silver、Immersion Tin、ENIG+OSP, ENIG+Gold finger, Flash gold(electroplated gold)+Gold finger(50u”), Immersion silver+Gold finger, Immersion Tin+Gold finger |
| Min. Annular Ring | 3mil |
| Aspect ratio | 10:1(HASL Lead-free 、HASL Lead、ENIG、Immersion Tin、Immersion silver、ENEPIG);8:1(OSP) |
| Impedance control | ±5ohm(＜50ohm), ±10%(≥50ohm) |
| Other Techniques | Blind/Buried Via, Gold Fingers, Press Fit, Via in Pad, Electrical Test |
